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Not a lot, acc. to Intel exec
Intel exec Mark Bohr said most of its production equipment can be reused for this
45nm process, including 193nm "dry" lithography instead of immersion. Said
there's a few added process steps but only result in "a small single-digit
percentage increase" in manufacturing costs.

As far as implications to specific suppliers (dunno if you meant investor-related,
since you use referenced ticker symbols), Intel didn't say who it's working with to
develop these high-k et al. technologies (the co. and suppliers tend to be tight-
lipped), but the list is a short one, incl. those you mentioned.
Posted by: montgomejj   Posted on: 01/29/07 You are currently: a Guest | Members login | Terms of Use

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So if I understand, AMD is  No_Ax_to_Grind | 01/27/07
This isnt anything new.  Been_Done_Before | 01/27/07
Any implications on chip equipment manufacturers like LRCX or AMAT?  leehjt12 | 01/28/07
Not a lot, acc. to Intel exec  montgomejj | 01/29/07
ALD also being used by Intel  montgomejj | 01/29/07

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